Combining advanced materials science, polymer chemistry, and precision failure analysis to create green, sustainable, and highly efficient non-destructive rework solutions for advanced packaging and microelectronics.
"Fort Advanced Materials" was founded on the pursuit of polymer materials chemistry and semiconductor process research and quality control. We observed that high-precision optoelectronic and packaged components often require large amounts of strong acids, alkalis, or highly toxic chlorinated solvents during manufacturing rework and failure analysis. This not only damages human health and the environment but also causes thermal conduction and chemical damage to high-value active chips and micro-lenses.
To address this, Fort Advanced Materials was founded by polymer chemists, optoelectronic semiconductor process experts, and precision instrument engineers. We specialize in developing safe, non-destructive debonding chemicals and auxiliary dyes, combined with patented localized thermal-control debonding systems. Our goal is to deliver efficient, safe, and sustainable software-hardware integrated solutions for precision microelectronics and failure analysis.
Integrating interdisciplinary materials chemistry and precision optoelectronics engineering to establish a comprehensive core technical system from specialty formulations to localized thermal control equipment.
Focusing on the development of advanced materials for LCD, advanced semiconductors, and multilayer PCBs, providing high-precision packaging rework and non-destructive debonding processes.
Formulating specific high-penetration and crosslinking-swelling active chemical formulas to precisely swell and peel cured UV adhesives and epoxies, achieving zero damage to substrates and components.
Developing self-developed patented non-contact localized infrared debonding hardware systems, utilizing micron-scale light spots and closed-loop temperature sensing to achieve precise selective thermally-activated rework.
Targeting sub-millimeter wire breaks on chips, we develop high-fluidity solder pastes and micro-aperture insulation repair sheets to facilitate rework drilling and reballing.
We follow the two core beliefs of green chemistry and digital empowerment to drive upgrades in high-precision packaging and rework yields.
Technology should never come at the cost of the environment. All debonding chemicals we develop exclude highly toxic dichloromethane, are chlorine-free and fluorine-free, and comply with EU RoHS and REACH regulations.
We develop non-destructive debonding agents (for UV/thermal adhesives), allowing high-value lens elements, BGA chips, and CIS sensor substrates to be reworked and recovered intact, driving a circular economy in electronics manufacturing.
Using advanced optical microscopy and defect interference color development technology, we transform transparent adhesive thicknesses that are extremely difficult to measure with the naked eye into precise quantitative data, safeguarding every step of process optimization.
