We adhere to green chemistry and quality control. Here, we explain the core interfacial molecular mechanisms behind semiconductor advanced packaging and precision rework chemistry in accessible language.
Cured high-strength UV adhesives or epoxy resins are difficult to remove due to 3D cross-linked networks. Fort's safe debonding solvents swell and penetrate, gently peeling them off without damaging PC and lenses.
Cured transparent UV glue has low reflectivity and strong light absorption, making conventional optical measurement difficult. Learn how Fort's patented dyes utilize interfacial capillary adsorption to develop high-contrast color, providing micron-scale interference and failure analysis data without destructive disassembly.
In advanced packaging such as CPO manufacturing, adjacent micro-lenses and active circuits are highly sensitive to temperature rise. This article reveals how our patented optical design focuses infrared energy on micron-scale gaps, activating the debonding solvent without conducting heat.
