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Safe eco-friendly polymer unlocker. Specifically designed for urethane acrylate and epoxy-based UV adhesives. Softens and releases interfaces gently, achieving damage-free peeling and rework of optical glass and sensitive PC substrates.
A specialty unlocking solvent developed for dual-component epoxy resins and other thermosetting hard adhesives. It penetrates deep into the 3D cured network under heating at 50°C-80°C to weaken polymer entanglement, enabling safe and mild recovery of bonded high-value dies or components.
A testing auxiliary chemical material specifically developed to inspect whether the thickness uniformity of transparent UV glue changes after semi-curing, curing, or heating of other components during the process. Through highly contrasted dyeing effects, it clearly reveals the microscopic thickness and uniformity distribution of the cured adhesive layer under microscopic and interferometric measurement, providing precise failure analysis data for packaging and dispensing process optimization.
Exclusive patented infrared-assisted localized selective debonding equipment, synergized with Fort's debonding chemicals, enabling micron-level precise rework without thermal damage to active components.
High-flow sub-millimeter solder paste and bonding formulation specifically tailored for micro-drilling holes, trace breaks, and BGA reballing.
Laser-machined thin insulation sheets with specific micro-apertures providing high-reliability insulation barrier and layout rewiring for stacked-die modules.
