This tool will guide you through 4 levels of steps to recommend the appropriate Fort debonding formula (L0-Gen-1 to LC0-Gen-5) and standard operating SOP based on your expertise.
If you have a chemical background or the spec sheet details the molecular structure, please select below:
If you have the original adhesive packaging or know its manufacturer brand, please select below:
Apply force with the needle tip on the adhesive surface and observe the rebound and texture:
Don't worry! Fort RD Tech provides a standard troubleshooting test kit. Please follow the SOP below to run the troubleshooting experiments and precisely find the suitable formula for your cured adhesive:
Clear surface debris to restore the part to its physical initial state (e.g. FPC attachments on CIS boards).
Submerge the part under the liquid level of L0-Gen-1 at room temp for 0.5 to 2 hours. If it weakens and prys off easily, the adhesive is likely Urethane Acrylate; use Gen-1 for subsequent processing.
If no reaction, submerge a new part in L0-Gen-2, tighten the cap, and heat in a 40°C-60°C water bath for 2 to 6 hours. If it weakens, the adhesive is likely Metha-acrylate.
If still ineffective, submerge the part in L0-Gen-3, tighten the cap, and heat in a 50°C-80°C water bath for 4 to 16 hours. If it weakens, the adhesive is likely Epoxy (unfilled). (Precaution: May damage PC surfaces)
If none of the above work, the adhesive is a highly rigid Epoxy/SiO2 filled underfill. Choose based on surrounding heat tolerance:
• Surrounding parts tolerate 100°C: Submerge in L0-Gen-4, seal, and heat in a 80°C - 100°C water bath for 24-96 hours.
• Surrounding parts sensitive to heat: Apply LC0-Gen-5 drip-resistant cream locally, isolate, and bake at 80°C-100°C for 24-96 hours.
Please select the type, brand, or hardness above, and we will calculate the most suitable debonding formula and steps for you.
Best Recommended Formula
