We focus our R&D capabilities on two major directions: "Advanced Microelectronics Packaging Rework Specialty Chemicals" and "Precision Failure Analysis (FA) Auxiliary Materials".
Fort Advanced Materials integrates materials chemistry and optoelectronic sensing to develop "Safe Non-destructive UV Debonding Solvents", "Safe Non-destructive Thermal Debonding Solvents", "UV Adhesive Dyes" and "Patented Optical Debonding Systems". We offer complete formulation lines and hardware-software integrated solutions, solving rework recovery bottlenecks for high-value optics and semiconductor packaging.
Technical Advantages:
"Swelling-Peeling" Synergistic Mechanism：Guides solvent molecules into the high-strength cured cross-linked network, swelling the volume and reducing adhesion, allowing it to be easily peeled off in sheets without damaging PC, optical glass, or gold wires.
Complete Formulation Family (Gen-1 to Gen-5)：Covers liquid types and translucent high-viscosity anti-drip pastes, suitable for bath immersion and local vertical application.
100% Green Chemistry Commitment：Chlorine-free, fluorine-free, low-volatility, meeting strict EU RoHS and REACH environmental regulations.
Main Application Markets for Non-destructive Debonding:
High-Value IC Rework (GPU/CPU Module)
Silicon Photonics Component Rework (FAU)
CIS Module Lens Replacement
Flexible LCD FPC Rework
IC Die Rework R&D
Fine Gold Artifact Restoration
Research & Auxiliary Product Lines:
Safe Non-destructive UV Debonding Solvent: For transparent crosslinked UV adhesives, utilizing mild infiltration and interfacial adhesion weakening to achieve damage-free peeling.
Safe Non-destructive Thermal Debonding Solvent: Deeply penetrates 3D cured networks under heating to weaken polymer entanglement, enabling safe recovery of high-value dies.
UV Adhesive Dye: Specialty colorant developed to inspect changes in transparent UV adhesive thickness after curing and heating. Provides high-contrast coloring under microscopy to map adhesive spatial distribution for failure analysis.
Patented Debonding Light-to-Heat Equipment: Patented infrared-assisted localized selective debonding system. Combines focused infrared light with precision temperature control to achieve micron-level selective debonding without thermal damage to adjacent circuits and micro-lenses.
We provide complete chemical swelling parameters and standard troubleshooting test kits for industry-leading adhesives such as Norland NOA, LOCTITE, Dexerials, and others.
